- 1.Tube Furnaces
- 2.Hydrogen Reduction Furnace
- 3.Shimmy Rotary Furnace
- 4.RTP Annealing Furnace
- 5.PECVD System
- 6.CVD System
- 7.Muffle Furnaces
- 8.Vacuum Muffle Furnace
- 9.Well Type Sintering Furnace
- 10.Bottom Loaded Sintering Furnace
- 11.Dental Sintering Furnace
- 12.Smelting And Quenching Furnace
- 13.Vacuum Pump System
- 14.Gas Mixing System
- 15.Commonly Used Accessories
- 16.Relevant Equipment
- 17.Industrial Furnace
- 18.Customer Unique Design

- Address: Kibbutz Zikim, Israel
- Phone: 972-8-9122667
- Mobile: 972-54-5460610
- Email: nbd@nbdlab.com
- Email: oremir15@outlook.com

PRODUCTS
PECVD Plasma Enhanced CVD Tube Furnace

product introduction:
PECVD tube furnace system(plasma enhanced chemical vapor depostion) is special euqipment for growth of high quality thin film on kinds of substrates.
Depostion temperature is adjustable from 100℃ to 1100℃,especially suitable for technology research of kinds of thin films in the laboratory.
Applicable for SiO2, SiNx ,, SiONx a-Si thin film deposition and diamond like carbon thin film depostion, at the same time the products can achieve TEOS source deposition, SiC film deposition, and other deposition liquid or gaseous source materials, especially for high efficiency protective layer film deposition of organic materials and no damage passivation film deposition under a specific temperature.
PECVD Plasma Enhanced CVD Tube Furnace System Introduction:
- Lower temperature processing compared to conventional CVD.
- Film stress can be controlled by high/low frequency mixing techniques.
- Control over stoichiometry via process conditions.
- Offers a wide range of material deposition, including SiOx, SiNx, SiOxNy and Amorphous silicon (a-Si:H) deposition.
PECVD Plasma Enhanced CVD Tube Furnace System Application:
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Plasma induced surface modification
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Plasma cleaning
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Plasma polymerization
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A variety of films deposited on the surface of SiOx, SiNx, amorphous silicon, microcrystalline silicon, nano-silicon, SiC, DLC, etc.
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selective growth of the carbon nanotubes (CNT)
PECVD Plasma Enhanced CVD Tube Furnace System Parameter:
- Model: NBD-PECVD1200-80ITD2Z
- Special screw dual reaction chamber system
- Mechanical pumpwith control power
- RF generator
- Fully digital touch screen temperature control system
- 2 channel mass flow meter (three channel mass flow meter available)
- PECVDdepostion: SiO2, SiNx ,, SiONx a-Si thin film deposition and diamond like carbon thin film depostion
- uniformty deviation:≤ ± 4% ( within 3inch)
- working space: 3inch, 10pS
- Sample size:2-3″
- working temp: 100~1200℃
- temperature control accuracy: ≤ ±1℃
- Model: NBD-PECVD1200-80ITD2Z
- Cleaning and coating RFpower: 20~200Wadjustable
- Tube diameter: Φ80mm
- Length of Heating zone: 200mm
- Max temperature: 1200℃
- Size: L1300xH1260xW820
- Power:AC220V,4KW
- Weight: 360kg
PECVD Plasma Enhanced CVD Tube Furnace System Working Principle:
PECVD Plasma Enhanced CVD Tube Furnace System Working Principle

PECVD tube furnace system
The gas is ionized and its activity is enhanced when gas goes through RF generator. After that gas moves to the heating temperature zone and deposit on the surface of the substrates.