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Equipment introduction:
Rotary pendulum PECVD system is suitable for thin film deposition on the surface of powder materials. The system is composed of high power RF power supply (500W, 13.56MHz), gas mass flow control system, vacuum system and rotary pendulum system. It adopts operating software of NBD-101EP centralized bus control technology. Plasma properties are used to control or influence the process of gas reaction and chemical reaction on the material surface and to deposit thin films at appropriate temperatures. PECVD deposited films have excellent electrical properties, good substrate adhesion and excellent step coverage. Because of these advantages, it has a wide range of applications in VLSI, photoelectric devices, MEMS and other fields.
Equipment introduction:
Rotary pendulum PECVD system is suitable for thin film deposition on the surface of powder materials. The system is composed of high power RF power supply (500W, 13.56MHz), gas mass flow control system, vacuum system and rotary pendulum system. It adopts operating software of NBD-101EP centralized bus control technology. Plasma properties are used to control or influence the process of gas reaction and chemical reaction on the material surface and to deposit thin films at appropriate temperatures. PECVD deposited films have excellent electrical properties, good substrate adhesion and excellent step coverage. Because of these advantages, it has a wide range of applications in VLSI, photoelectric devices, MEMS and other fields.
Configuration
Main features: | ||||
Electrical Spec | AC220V 1.5KW | |||
Equipment Dimensions | W1300mm×H1250mm×D760mm; | |||
| Reaction Chamber | Φ120*L300mm (customizable; three mixing baffles welded inside the tube), tube diameter outside the RF zone: φ60mm. | |||
Rotation Speed | 0.1~6 rpm (stepless speed control) | |||
Tilting Angle | -3°~+3°; maximum tipping angle 30° | |||
Reaction Chamber Pressure | 5~80pa | |||
Flange Configuration | Quick-Opening Aerospace Aluminum Configuration | |||
Operating System | NBD-101EP integrated central-bus control system with a 7-inch full-color touchscreen, intelligent fuzzy PID control, and interactive controls. | |||
Electric Actuator Power | 50W | |||
RF Power Supply | Output power 10~500W, continuously adjustable; RF frequency: 13.56MHz ±0.005%; fully automatic matching. | |||
Vacuum Test | Digital Vacuum Gauge Acquisition Unit | |||
Vacuum Generation | NBD-4C mechanical vacuum pump (220V/50Hz), power: 0.4KW, pumping speed: 4m³/h. | |||
Gas Supply System | Mass flow controller (range and calibration customizable), accuracy: ±1%F.S; response time: 1-4s. | |||
Equipment Details |
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Interface Examples |
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Control System | 1. Sintering profile settings: dynamically displays the configured profile, stores multiple process profiles, and allows each profile to be set individually. 2. Scheduled sintering supports unattended execution of the programmed profile. 3. Displays sintering power, voltage, and other information in real time, records process data, and supports export for paperless records. 4. Supports remote operation and real-time equipment status monitoring. 5. Temperature correction: nonlinearly corrects the difference between the main control temperature and sample temperature throughout sintering. | |||
Net Weight | Approximately 320KG | |||
Operating Precautions | 1. The RF matching unit normally operates in automatic mode; matching generally requires power above 50W. | |||
Service and Support | 1 year limited warranty with lifetime support. | |||
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