Remote source plasma sputtering system
The remote source plasma sputtering system is different from the RF magnetron sputtering system, which is completed by generating a high-density plasma at a distance from the target. The plasma is amplified by the transmitting electromagnetic coil at the outlet of the PLS, and the concentrating coil completes the concentration and control of the plasma direction, covering the target surface. By applying a negative bias to the target surface, a high-density current is formed on the surface, and the target material is uniformly etched. Compared with conventional magnetron sputtering, the phenomenon of target poisoning is reduced, and the deposition rate of non-metallic thin films is increased. At the same time, a DC bias voltage can be applied to the target for sputtering insulating targets.